Intermediate Technical Japanese, Volume 2: Glossary

Lesson 37: Materials V (material processing)

Lesson 37: Materials V (material processing) 37-1: II~ *~ J±$MfFffl itlv~fFffl __fFffl f#~fFffl f#~tl-f* *~fFffl D~8 f#~m ~-)v~)v fttim@J~ 7 ~ 1) '/ ~ 3 /' ~ )V f#~*ftJ3t~tJ: ~f#~ tt~ tJ~~fO tt~~~v) ~2~Jit~;t ~~¥i1 ?6rM!~-f* ~~¥i1~!m ~n~?pv) ~!J 0 7~7 r) /~JJJ "",e (J) t::. 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L?!>~171 ~1J-1~-17-1 v) ::c7}-~17-1 7-1~3?~3?~-1 ~ 'Y::I ?ti~t~ V)::U*?*r.7 r-7~:J.t:/ 7/ 1 ) 3?1\-1::Jr.7 ::I 7 I/v)ti~t~ v)::tr */~v/71 t-17"-1~ t -1 7"-1 7'Y 1) 3 7 T/1JA-17~/ 7-1~3?t-17J7 ::I?./? 1) 'Y 3'7v/ 2.-v7t~ t-1V/ 7 )v7J 1) 3 '7I:t: 7/1J-1t-1V/ slip, slurry paste lump, clump, clod method for forming/molding/shaping body {ceramics} water/moisture content dry pressing plastic shaping/forming slip casting subclassification (method for) forming/molding hand molding, molding by hand machine molding, molding by machine slip casting slip-like state, slurry-like state gypsum mold (method for) casting special(ty) product mixing/compounding of raw materials graphite mold to cast clay brick friction press toggle press hydraulic press rotary press press forming/molding pressure amount ofwater added (degree of) precision in shape/form high efficiency smelting gangue mineral refining flux alkalinelbasic solution electrolytic refining 7-1'JA~T~'Y7/VA ~~m ~~~~ J±JJ~1* ::t-/V77/ 59=7~/V7 7Y 1) 37;,\-1 ~1 -390isostatic pressing metal powder thin-walled metal pressurizing medium -~~~ 7J'-/VA 1::-t-17-1~-1 7~~.:z.!J-t-17-1:t: object to be molded/formed/shaped pressurized molding/forming/shaping equipment final product rubber press *~"7-1'JA~T,{~!J/VA TfjjUpt~-1* ~1I-1* 1fl~~1< !tAm5tt :If'Mtt~Im~~-1* 1JD~m*5 *~"/VA -$dJ1Jrfij ~1J1JDJ± ~itlflj~~ flf7!lm*5 fJffnB~J3t -rfrmm*6 :t-//~7 ~~(B~* 37-8: _~ ~W.:r.*,J!t:¥­ Jm~fnii l:f:lWl ~Wl -=.~JSW i~~mm *1l~Htltt -f*flHtltt ~~·~m ~ttifrfjJJ mtmm~ 37-9: m~I~ mlil!~1ilI~ ~-~~"Iffit ~~* 3l::-t-17-1~-1 1::7!J~-1 :t: /'J'!J ~1 < 7 r)=.:Lr) ~. ~ :t:7 jJ ~-t-17/-1 :t:-J'-1 ~-1 -1T~!J*t7:Ir) "r)*r)jJ7'Y :t:/~'Y:Jr)~'Y~ T-1:t/~3?7'Y 1) D/~ 'Y ~ 3l::~3r)7'Y I:: 3 r) j.. / .:r.*'J!t:¥- 'J!J~D/ :r.:L9:t: ~.:L9:t: ~/~~/jJ-1 ~3ry7'Y:t::J? 1) .:L r) jJ -1 jJ !J ~ / ~-1-t:t:jJ!J~/ ~ 3 r)/\ 'Y · ~ 3 ry ~ ::L !7 *'/t-1 1 ) ::L r) ~ ry I.:t:'Ji)~3r)7'Y 73 r):J9:f9:t-/':J9~ ~- ~ ~ ":J i) ~l :t:/'J'!77-1 -391hot isostatic pressing premolded/preformed objectlbody covering metal foil encapsulation and degassing medium that provides an inert atmosphere heating and sintering hot press uniaxial isostatic pressurization, application of uniform pressure in all directions homogeneous and high density low-temperature sintering theoretical density pre-sintering open pore defect elimination/removal to seal/consolidate a material by firinglbaking surface energy kinetics middle stage/period final stage/period three-stage, three-step sintering mechanism grain boundary diffusion bulk diffusion evaporation/vaporization and condensation viscous flow liquid-phase sintering cemented carbide tool cermet tool metal system 37-10: J±~ ~ra'O) 51~ts J±~~1$ J±~_~fJl._ MJ3t1J[]~~tJ:*9 ltlfiti 5'}f& ~l3G Mf& M{1~D-)v mU1J A~ !l~Jjjfun~~,j J±~tI 1) /7~~~~ ~77~ ?/ ~ V)V itlufL ~tR~~£t&~oo fi!ilf*JI ~{~T7'/' rl{~T7' /' 37-12: MOCVD MOCVD 5«,f§-@jpx~ 7 )v=t-}v{~~!fo/J 1ftl~~{~-@J~ 7 )v:J =t-~ ~ ~~~m{t:-@J~ !:t~fJ"J{~i1ffi. !l!J*Tjj~ {~~~f§px~$ ER{t:71<*~f* ~!1H A1J~~OO JI~ER* 1JDEEi~tJ: ~ G *'YtJ/O) D~~ts 7'Y~:J..!JI./~/ 7'YI./'"t/1'J~=t- '!f1 ~:JJ *''Y~~tJ: *9 ~::L'YtJ tJ1/\/ '.!rJ--e/ :J rJ/\ / JJ...7C-:; ~ 0 - )v 'J!J*':7 *~~':7 1717'/~/71~1 7'YI./=t1 ) /7~V 3 rJ'"t1t: / itlu:JrJ tJ/:/3rJt-1l::/ =t-/\/t: 3 rJ ~ / :J7'-1'J':7 7'/:JJT7'/ T'YtJ=f-7'/ =t-'J':7:1':7'"t-1*':7 7 )v=t-)vtJ =It) 7~'Y ::z.t)=t-=t- / '/7 jJ :1rJ 7~ 'Y =t- / '/7 ::z.'7=t-jJ :Jry 7~ 'Y l::.7J7r=t-r-1::t/ 7'/7/~'Jt)?7 jJti7=t-'J':7'"t-1T3t)*':7 7'/jJA-1'J=t-~-1 Gt::..V D'Y~rJ~jJ/;{/ 'Jt)V3t)~/'J tJ7'Y~~tJ:*G -392hot to draw in, to pull in, to drag in compression and extension rolled/flattened fiber structure to repeat heating and annealing sending out, shipping outside (body) panel/plate shipbuilding steel sheet/plate grooved roll lateral (position), (to) the side round bar, cylindrical rod material with an unusual cross section rolling mill ring-shaped product plug mandrel piercing, boring tubular/annular product substrate surface solid layer titanium carbide titanium nitride metal organic chemical vapor deposition gas-phase synthesis alkyl compound organometallic compound alkoxide organometallic compound relatively low temperature monolayer film chemical vapor deposition hydrocarbon gas base, foundation, backing, substrate hexagonal poly-cyclic plane/surface layered carbon pressure annealing 1'-1 0 1 ) 7-1 'Y 7 7~77Y-11' 7.::cJv7 Y A ~ 1) :J / 1~~~m~~ ~m~~$ oc~f!~fi *~~I~ ~tI~~ ~1t~~~7tm~m ~~ ~It~~~m~~$ A..70fl4~ *~-f*v-'"!f-~-T 37-14: 77-X~ /7'A''7( IPJ~ ~~-1;t/ mlmO) 7t~~riI/7A'7( /7'A''7(*llr AHillir!ft mli1li~ ~oc~ ~~oc~ re~OC~ ~~re~OC~ 1lt7t1&m~«tJ±~-f*1&~ mfllJ3t *llrrf:l'lIJ~ mrtffitIt -1 ;t / r!ftJ3t ~tt*llrr!ftJ3t ~1*rtJlrj ~m-f* AHillir!ft/ 7 'A''7( ~I!I!~~ ~T1;t/' ~f*~7A'-X 37-15: /7-X~ CVD 7°7A'-XtR~ .lJl~7°7 A''7( ~7°7A'-Xrt ~¥¥i17° 7 'A''7( {~r!ft 7°7 A'-xr! tJtJ7:1=-'JrJt-1T3rJ :1=-'JrJt1T3rJ*9 1\// rJt-1:; 3 rJT~ 7 /\/ ~rJ7'1 :J9~3 9 :1.9 :t::1=- / 'J~7 :1.rJ=t::t:/'/7*'Y7/tJ1:1=-'J9 t-1T39 :1.9:1=-:1=-/'/7:1=-'JrJt1T39*9 A..70:JrJYry J\ /' ~ ry ~ 1 v-'"!f-'J ~ ~9ArJ :1=-7'-1-1;t/ 7'~-1 ~1v0) tJ/~/7/1)/7A'7( /7 'A''7( 1) .:L r) ~ T3r):Jr);t/ 'J9:i~3rJl''Y tJ71\/ / rJ *'YtJ 7 J\ /' / rJ :ti):ii)/\/ / r) *'YtJ 7:1.9 ::JrJ/\ / / rJ 7-1::Ir)*rJ7/tJ/ 7-17'Y:1=-7'1*r)7/ 7/ 1 ) ~ 1) .:L r) ~ 11 / ~ 3 r) l' 'Y T/~;t/~ -1;t/;t/~ T.:L '7t-1 1 ) .:L rJ~;t/ ~ =t:-~1*ry'J7 ~r)T/~-1 T 3 r):J r);t//7 'A''7( 117::1..r):1r)0 :Jr)Y1;t/ :J ~ 17°7 A'-X 7'7 A'-X :; 3 r) ~ -1 A..-1 :J r) ~7 A'-X *''Y7'7 A''7(*r) 1::: A..1 ::I r) 7°7 'A''7( 7-1:t" /7'7 'A'-x*':7 -393pyrolytic graphite amorphous silicon chemical vapor deposition vapor phase growth reactive deposition semiconductor industry organometallic compound metal organic chemical vapor deposition (MOCVD) organometallic chemical vapor deposition heterostructure semiconductor laser device plasma same/identical number gaseous ion fourth completely ionized plasma plasma particle ultra-high temperature collision nuclear reaction thermonuclear reaction fusion reaction thermonuclear fusion reaction fluorescent discharge tube low-pressure gas discharge degree of ionization collision between particles electron temperature ion temperature neutral particle temperature gas law conductor ultra-high temperature plasma (nuclear) fusion reactor lattice ion solid state plasma plasma state equilibrium plasma thermal plasma (method) nonequilibrium plasma low-temperature plasma (method) 7 ~7J JLt~tJ: 7'Y*1~{f~ t:/*-JLt 37-17: /7A"";(;):r. 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':7 ~ ~3':71'~7JT1 1\7 ~ I' I) 'Y 7 jJT1 ~/' r':7 A~7 I')~ -395arc -plasma engine nuclear fission reactor artificial satellite attitude control test of practical application teflon thruster heavy pulsed current teflon plasma magnetohydrodynamic acceleration external coil the electric current itself self-magnetic field hole accelerator (particle) accelerator heavy current pulse pulsed plasma accelerator electrostatic neutralization of electric charges high-velocity plasma beam ion engine mercury ion thrust specific impulse mass flow rate propulsion engine, thruster jet velocity consumption rate for injected fuel long-distance flight final cruising velocity/speed power, strength, might plasma heating relaxation process heating efficiency confinement time heating (method) injection method absorption process Joule heating adiabatic compression heating wave heating Landau damping high-energy particle collision process parametric process vibrational spectrum 37-22: :1'5;(~~ /7A?i1f ~~~ MG~~~~ /7A'?~~~fll /7A?~1iX:$ ~~mt_ I\)~A /7 A?i1f ~~1it/7A?~ ~1it/7A?~ illmtt&m/7A?l1]{ i9i}aj~/7A?l1]{ ~1!kit:JII -~tt ilI~tt 1\7 ~-?7-fBtm ~~EJa9 lt~fj(j/J\mm #.J~~~ ~7ttt 71